MEMORY MODULE |
---|
Manufacturer |
Team Group |
Series |
Not determined |
Part Number |
TEAMGROUP-UD4-3200 |
Serial Number |
0104B7DBh |
JEDEC DIMM Label |
8GB 1Rx8 PC4-2400R-UA2-11 |
Architecture |
DDR4 SDRAM UDIMM |
Speed Grade |
DDR4-2400R |
Capacity |
8 GB (8 components) |
Organization |
1024M x64 (1 rank) |
Register Model |
N/A |
Manufacturing Date |
December 2-6 / Week 49, 2019 |
Manufacturing Location |
Taiwan |
Revision / Raw Card |
FF00h / A2 (8 layers) |
DRAM COMPONENTS |
---|
Manufacturer |
Samsung |
Part Number |
K4A8G085WB-BCPB |
Package |
Standard Monolithic 78-ball FBGA |
Die Density / Count |
8 Gb B-die (Boltzmann / 20 nm) / 1 die |
Composition |
1024Mb x8 (64Mb x8 x 16 banks) |
Input Clock Frequency |
1200 MHz (0.833 ns) |
Minimum Timing Delays |
16-16-16-39-55 |
Read Latencies Supported |
18T, 17T, 16T, 15T, 14T, 13T, 12T... |
Supply Voltage |
1.20 V |
XMP Certified |
1600 MHz / 14-14-14-34-100 / 1.35 V |
XMP Extreme |
Not programmed |
SPD Revision |
1.1 / September 2015 |
XMP Revision |
2.0 / December 2013 |
FREQUENCY | CAS | RCD | RP | RAS | RC | FAW | RRDS | RRDL | WR | WTRS |
---|---|---|---|---|---|---|---|---|---|---|
1200 MHz | 18 | 16 | 16 | 39 | 55 | 26 | 4 | 6 | 18 | 3 |
1200 MHz | 17 | 16 | 16 | 39 | 55 | 26 | 4 | 6 | 18 | 3 |
1200 MHz | 16 | 16 | 16 | 39 | 55 | 26 | 4 | 6 | 18 | 3 |
1067 MHz | 15 | 15 | 15 | 35 | 49 | 23 | 4 | 6 | 16 | 3 |
933 MHz | 14 | 13 | 13 | 30 | 43 | 20 | 4 | 5 | 14 | 3 |
933 MHz | 13 | 13 | 13 | 30 | 43 | 20 | 4 | 5 | 14 | 3 |
800 MHz | 12 | 11 | 11 | 26 | 37 | 17 | 3 | 4 | 12 | 2 |
800 MHz | 11 | 11 | 11 | 26 | 37 | 17 | 3 | 4 | 12 | 2 |
667 MHz | 10 | 9 | 9 | 22 | 31 | 14 | 3 | 4 | 10 | 2 |
FREQUENCY | CAS | RCD | RP | RAS | RC | FAW | RRDS | RRDL |
---|---|---|---|---|---|---|---|---|
1600 MHz | 14 | 14 | 14 | 34 | 100 | 48 | 12 | 12 |